When soldering electronic components onto circuit boards, the temperature curves of the reflow ovens across different zones and the conveyor belt speed significantly influence the product quality. This study focuses on optimizing the furnace temperature curve under varying settings of reflow oven zone temperatures and conveyor belt speeds. To address this, the research sequentially develops a heat transfer model for reflow soldering, an optimization model for reflow furnace conditions using the differential evolution algorithm, and an evaluation and decision model combining the differential evolution algorithm with the Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) method. This approach aims to determine the optimal furnace temperature curve, zone temperatures of the reflow oven, and the conveyor belt speed.