Silicon carbide (SiC) and gallium nitride (GaN) are used as wide-bandgap semiconductor materials in the hardware development of integrated circuit detection systems. The impact of material characteristic differences on system performance needs to be considered, and hardware platforms should be adapted to construct a three-dimensional technology management system. In addition, interdisciplinary team collaboration, heat dissipation structure design, long-term reliability assessment and other management aspects, as well as supply chain collaboration, packaging technology selection are of great significance to research and development, and technical management can provide scientific guidance.