ARTICLE
Volume 8,Issue 7
29 March 2024
Failure Analysis and Technical Development of Electronic Components
Xiuku Dan
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1
Foundation Department, Engineering University of PAP, Xi'an 710086, China,
erd 2024 , 6(3), 123–127;
https://doi.org/10.26689/erd.v6i3.6621
© 2024 by the Authors. Licensee Whioce Publishing, Singapore. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution 4.0 International License ( https://creativecommons.org/licenses/by/4.0/ )
Abstract
The failure analysis involves researching a product to identify its failure mechanism and components. This allows for targeted improvements to prevent subsequent issues and enhance the product’s stability. In the context of electronic component failure analysis, testing and analysis are employed to elucidate the failure process and identify the underlying causes, ensuring the smooth operation of components. This paper introduces some simple and cost-effective analysis methods. During the electronic component failure analysis, sensory examination and internal analysis can aid in judgment. Leveraging extensive analysis experience and utilizing relevant facilities correctly can lead to cost reduction and an increased success rate.
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